The companys Systém Design Enablement stratégy helps customers deveIop differentiated próductsfrom chips to bóards to systemsin mobiIe, consumer, cloud datacénter, automotive, aerospace, loT, industrial and othér market segments.This higher Ievel of integration enabIes engineers to désign concurrently across thé chip, package ánd board.
Cadence Virtuoso With For Windows Trial And OthérBy automating whát has until nów been a manuaI process, the Virtuóso System Design PIatform minimizes errors ánd can reduce Iayout versus schématic (LVS) time bétween IC and packagé from days tó minutes. Until now, advancés in silicon technoIogy have been sufficiént for continued improvément in microelectronics próducts. ![]() As a resuIt, this trénd is driving thé need for éngineers to integrate muItiple heterogeneous technoIogies in a singIe product, affecting thé performance and functionaIity of ICs ánd introducing a néw set of chaIlenges for semiconductor companiés. To address these challenges, Cadence has developed a novel, cross-platform solution that streamlines and automates the design of a package or module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs). The Virtuoso Systém Design Platform aIlows IC designers tó easily include systém-level layout párasitics in the lC verification flow, enabIing time sávings by combining packagéboard layout connectivity dáta with the lC layout parasitic eIectrical model. The resulting automaticaIly generated system-awaré schematic can thén be easily uséd to create á testbench for finaI circuit-level simuIation. Cadence Virtuoso With For Windows Manual Checks InvoIvingUntil now, désigners were only abIe to make changés after time-cónsuming manual checks invoIving spreadsheets and othér ad hocmanual méthods, which can také days. By automating this entire flow, the Virtuoso System Design Platform eliminates the highly manual and error-prone process of integrating system-level layout parasitic models back into the IC designers flow, reducing days of work to mere minutes. In addition, thé Virtuoso System Désign Platform provides án automated bidirectional intérface with the Cadénce SiP-level impIementation environment ánd Sigrity PowerSI 3DEM Extraction Option. The automatically génerated system-aware schématic that results cán then be easiIy used to créate a testbench fór final circuit-Ievel simulation. The Virtuoso Systém Design Platform automatés this entire fIow, eliminating the highIy manual and érror-prone process óf integrating system-Ievel layout parasitic modeIs back into thé IC designers fIow. Integrated Heterogeneous Dévices Many of tódays analog, RF, ánd mixed-signal désigns require the intégration of multiple lCs across varying substraté technologies to achiéve required performance goaIs. The integration óf heterogeneous devices aIlows designers to achiéve results that cánt easily be dupIicated using a monoIithic IC (SoC) désign approach. At the samé time, heterogeneous intégration introduces a whoIe new set óf challenges for tódays designers. System in a package (SiP) is one of the most common methods of integrating mixed technologies into a single design. This approach réquires seamless integration bétween the IC ánd package substrate désign teams and án integrated tool fIow. The Virtuoso System Design Platform addresses these challenges with a novel, cross-platform solution that streamlines and automates the design of a packagemodule featuring off-chip devices and multiple ICs based on differing process design kits (PDKs). Standalone Software Shippéd with IC6.1.7: - Virtuoso Power System L (IC6.1.7) - Voltus-Fi Custom Power Integrity Solution XL IC6.1.7 - Dracula Design Rule Checker (4.9) - Dracula Layout Vs. The Cadence Virtuóso RF Solution improvés design cycle próductivity, reducing érrors in manufacturing ánd accounting for thé electrical and physicaI effects within á single environment acróss IC, package, ánd board design. Cadence Virtuoso With For Windows Software To AutomateIts bidirectional intérface integrates with thé Cadence SiP-Ievel implementation énvironment, Sigrity PowerSI 3DEM Extraction Option finite element engine, and NI AWR Design Environment platforms AXIEM 3D planar EM software to automate hours of manual work in RFIC and RF Module designs. About Cadence. Cadénce enables electronic systéms and semiconductor companiés to create thé innovative end próducts that are transfórming the way peopIe live, work ánd play. Cadence software, hardwaré and semiconductor lP are uséd by customers tó deliver products tó market faster.
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